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MIC-733-TS
MIC-733-TS
MIC-733-TS
MIC-733-TS

MIC-733-TS

NEMA TS2 AI Inference System Based on NVIDIA® Jetson AGX Orin™

  • Compact fanless design
  • Embedded with NVIDIA® Jetson AGX Orin™
  • NEMA TS2 compliance
  • -34 to 74°C operating temperature support
  • 500ms power interruption backup (Based on NEMA TS2)
MIC-733-TS _ 技术规格

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Specifications

NVIDIA® Jetson AGX Orin™
 

 

Processor

NVIDIA Jetson Series AGX Orin 32G
CPU 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor Cores, Maximum Operating Frequency: 930 MHz
Al Performance Reference Up to 200 TOPs
Memory 32GB 256-bit LPDDR5 DRAM
 

 

 

I/O

Ethernet 4 x 10/100/1000 Mbps (Support 4 x Gigabit PoE/2 Gigabit PoE+ with 60W power budget)
Display HDMI (Max. resolution 3840x2160 @ 60Hz)
USB 2 x USB 3.0
Digital I/O 4-ch DI, 4-ch DO
Power Switch 1 x Power ON/OFF Button
Serial Ports 2 x RS-232/422/485 (On-board pin header)
OTG USB 1 x Micro USB
 

 

Expansion

Mini PCIe 2 x mPCIe (Signal: PCIe+USB)
SIM 2 x Nano SIM slots
M.2                                            1 x M.2 3052 (B-Key, Signal: USB)
TPM (Optional) 1 x TPM 2.0
iDoor (Optional) 1 x iDoor bracket reserve
Storage M.2                                            1 x M.2 2280 M-Key Slot, pre-installed NVMe with 512G 3D TLC BiCS5 (-40~85°C)
SD Card 1 x Micro SD slot
Power Mode AT/ATX (Default AT)
Input Voltage 12 VDC (With external 240W Adapter) (pre-configured with hardened power adaptor/power core)
 

Environment

Operating Temperature -34 ~ +74 °C with 0.7 m/s airflow (in 30W AGX Orin mode)
Operating Humidity 95% @ 40 °C (non-condensing)
Vibration 3Grms @ 5 ~ 500 Hz, random, 1 hr/axis
Shock 10G / 11 ms
 

Mechanical

Dimensions (W x D x H) 192 x 290 x 87 mm
Weight 4.5 kg (9.9 lb)
Installation Desktop / Wall mount
BSP Jetpack Above 6.1
Certifications NEMA-TS2/CE/FCC (No RED certification)

* Depending on the installation conditions and interface connections, it is possible for performance derating for cellular LTE module and the MAXN mode of AGX Orin in the maximum operating temperature, as for the wireless module application, please check the its user documentation first.

 

Ordering Information

Part Number NVIDIA Module Memory eMMC NVMe
MIC-733-TS5A1 AGX Orin 32 GB 64 GB N/A

 

Packing List

Part Number Description Quantity
MIC-733-TS AI Inference System 1
1652003234 Power terminal block 4P 1
1652005204 DI/DO terminal block 5P 2
1700023619-01 Micro USB cable for system recovery 1
1702002605 Power Cord EU 3P 10A 250V C13 183cm (EU) 1
1702002600 Power Cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D 1
XMIC-FSP270-RHAN3 Power Adapter A/D 100-240V 240W 12V TERMINAL BLOCK 4P 1
98917330011 PoE Board Total 60W output supporting 4 port PoE / 2 port PoE+ 1
SQF-C8MV2-512GDEDE NVMe with 512G 3D TLC BiCS5 (-40~85°C) 1
1960115344N001 MOUNTING Bracket 2

 

Optional

Part Number Description Quantity
 

 

 

SSD

96FD80-P1TB-TS1 SSSTC M.2 2280 1TB NVME G4x4 SSD -25°C ~85°C 1
SQF-C8MV4-1TDEDC SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) 1
SQF-C8MV4-1TDEFM SQF M.2 2280 730-D 1T 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MZ2-128GDEDE SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) 1
SQF-C8MV2-512GDEFE SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-40~85°C) 1
SQF-C8MV2-512GDEFN SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MV4-2TDEDC SQF M.2 2280 720-D 2T 3D TLC BiCS5 (0~70°C) 1
SQF-C8MV2-128GDEDM SQF M.2 2280 720-D 128G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MV2-512GDEDM SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8BV4-1TDEDC EWM-W173H01E SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C)

Wi-Fi 6+BT 5.0 Module 2.4/5GHz Mini PCIe

1

1

 

 

Wifi

EWM-W172H01E Wi-Fi 5+BT 4.2 Module 2.4/5GHz Mini PCIe 1
1751000626-01 Cable Ant. SMA/F-R MHF1/113 BLK L250mm 2
1751000717-01 Dipole Ant.WiFi 6E SMA/M-R RG178 BLK L183mm IP67 2
1751000460-01 Dipole Ant. WiFi 6E SMA/M-R BLK L111.7mm IP54 2
9656EWMG00E Half-size miniPCIe to miniPCIe bracket set 1
1960081193N002 IDOOR ANTX2 Cover for MIC-733AO Powder 432C (Support 2 additional Wifi antennas) 1
1960119127N001 Bottom Cover-IDOOR for MIC733AO-DERQ Powder 432C (with 2nd side idoor cover opening) 1
 

5G

AIW-356-DQ 5G Sub6+GNSS M.2 3052 Key B (by region) 1
1751000623-01 Cable Ant. SMA/F MHF4L/113 BLK L300mm (5G) 4
1750009372-01 Ant.SMA/M 90/180 5G BLK 167mm RG178 (5G) 4
Power Cord 1700029019-01 Power Cord (PSE/BSMI), 3-pin, 7A, 125V, 1.8 M, DAC-ST01 1
OOB Extension 98RV710AL00 Allxon OOB module 1
Serial Port Extension 1700019968 F Cable 2x10P-2.0/D-SUB 9P(M)x2 15CM for On-board serial ports pin header extension 1
1960068789T008 IDOOR COMX2 Cover for On-board serial ports pin header extension 1
iDoor Accessory 1960065854N021 PCM series module bracket for supporting idoor cover fixing 1
TPM 2.0 PCA-TPMSPI-00A1 TPM 2.0 Module by SPI interface 1

 

Remote Management Enrollment

Enroll in 24/7 secure service to get all the features of remote device management on one centralized cloud portal - Allxon Portal.

*Supports JetPack 4.4 GA and above

 

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