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| Computing System | CPU | Intel® Core™ I5-1245UE 10cores,12M Cache, up to 4.40 GHz |
| Intel® Core™ i7-1265UE 10cores,12M Cache, up to 4.70 GHz | ||
| Memory | Memory (default) 8GB DDR5 (supports up to 32GB DDR5 SODIMM) | |
| Wi-Fi (M.2 2230) | 1 (for Wi-Fi 6E) | |
| BlueTooth | BT5.3 (option) | |
| OS | (Optional) Win10 LTSC; Win 11 Pro; Ubuntu 20.04 | |
| Storage | Primary Storage | NVME M.2 SSD 256GB (Max. support 2TB) |
| I/O | DC in | x 1, DC 12V, max. 84W |
| USB 3.1 Gen2 (Type A) | x 4 | |
| USB 3 Type C | x 1 (For display only) | |
| COM, RS232 | x 1 | |
| HDMI | x 1 | |
| LAN non-isolation | 1G x 2 | |
| Mic in/ Head phone out | x 1 | |
| Physical Characteristics | Dimensions (W x H x D) | 169.5 x 230.6 x 43mm |
| VESA Mount | 100 x 100; 75 x 75mm | |
| Weight | 1.5kg | |
| Power Input | AC/DC | AC:100-240V, 96W, DC:12V, LOCK PLUG, Medical grade |
| Power Button | Power with LED indicator | x 1 |
| Certificate | EMC & Safety Cert. | Medical CE, FCC, IEC/EN 60601-1-2 4.1th, IEC/EN 60601-1 3.2th |
| Environment Temperature | Operating | 0 ~ 35 °C/32 ~ 95 °F |
| Storage Pressure | 0 ~ 50 °C/32 ~ 122 °F
700-1060 hPa (Operation) 700-1060 hPa (Storage/Transportation) |
|
| Humidity | Operating | 10 ~ 95%, 40 °C |
| Storage | 5 ~ 95%, 60 °C | |
| Shock Resistance | 10G peak acceleration (11ms duration) | |
| Warranty | System 2 years | |
| Part Number | Description | DRAM | SSD | WIFI |
| USM-100H-5400DA1 | Core i5,8G RAM,512G M.2 SSD, DC In | 8GB DDR5 | 512G M.2 SSD | Optional |
| USM-100H-7400DA1 | Core i7,16G RAM,512G M/2 SSD. DC In | 16GB DDR5 | 512G M.2 SSD | Optional |
| Region | Part Number (DC Model) |
| USA (Thailand, Philippines) | 1702002600 |
| Europe (Indonesia) | 1702002605 |
| UK (Singapore, Malaysia) | 1700018704 |
| Japan (PSE) | 1700000237 |
| Part Number | Description |
| SQR-SD5N8G4K8SNGBB | 262pin SODIMM DDR5 4800 8GB 1.1v 1Gx16 (0 ~ 85 °C) Samsung |
| SQR-SD5N16G4K8SNBB | 262pin SODIMM DDR5 4800 16GB 1.1v 2Gx8 (0 ~ 85 °C) Samsung |
| SQR-SD5N32G4K8SNBB | 262pin SODIMM DDR5 4800 32GB 1.1v 2Gx8 (0 ~ 85 °C) Samsung |
| SQR-SD5N8G4K8MNGAB | 262pin SODIMM DDR5 4800 8GB 1.1v 1Gx16 (0 ~ 85 °C) Micron |
| SQR-SD5N16G4K8MNAB | 262pin SODIMM DDR5 4800 16GB 1.1v 2Gx8 (0 ~ 85 °C) Micron |
| SQR-SD5N32G4K8MNAB | 262pin SODIMM DDR5 4800 32GB 1.1v 2Gx8 (0 ~ 85 °C) Micron |
| SQR-SD5N8G5K6SNGPB | 262pin SODIMM DDR5 5600 8GB 1.1v 2Gx8 (0 ~ 85 °C) Samsung |
| SQR-SD5N16G5K6SNPB | 262pin SODIMM DDR5 5600 16GB 1.1v 2Gx8 (0 ~ 85 °C) Samsung |
| SQR-SD5N32G5K6SNPB | 262pin SODIMM DDR5 5600 32GB 1.1v 2Gx8 (0 ~ 85 °C) Samsung |
| Part Number | Description |
| SQF-C8MV2-128GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 128G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8MV2-256GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 256G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8MV4-512GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 512G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8MV4-1TCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 1T 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8MV4-2TDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 2T 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8BV2-128GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 128G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8BV2-256GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 256G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8BV4-512GCEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 512G 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8BV4-1TDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 1T 3D TLC BiCS4 (0 ~ 70 °C) |
| SQF-C8BV4-2TDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-C 2T 3D TLC BiCS4 (0 ~ 70 °C) |
| Part Number | Description |
| EWM-W165M201E | Intel® Dual Band Wireless-AX210 (WiFi 6) |
| 1751000449-01 | PCB Ant. 2.4+5+6G WIFI 6E MHF4L/113LL BLK L250mm |
| 1751000450-01 | PCB Ant. 2.4+5+6G WIFI 6E MHF4L/113LL GRY L150mm |
| 1930001074*1 | Screw M3x5L |
| 1935020300*4 | Screw M2x3L |
| 1990027162N01*1 | Thermal Pad 19.5X19.5X1.5 |
