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研华MIC-770 V3 是一款Intel® 第八/九代Core™ i 台式机处理器 (LGA 1151)紧凑型无风扇系统工控机，支持宽温：-10 ~ 50℃和VGA和HDMI输出
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Specifications
|
8th/9th Generation Processor (TDP 35W) |
CPU | I7-9700TE I5-9500TE I3-9100TE | i7-8700T | i5-8500T | ||
| Core/Thread number | 8/8 6/6 4/4 | 6/12 | 6/6 | |||
| Base Frequency | 1.8GHz 2.2GHz 2.2GHz | 2.4GHz | 2.1GHz | |||
| Max Turbo Frequency | 3.8GHz 3.6GHz 3.2GHz | 4.0GHz | 3.5GHz | |||
| L3 Cache | 12MB 9MB 6MB | 12MB | 9MB | |||
| Temperature | -10 ~ 50 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) | |||||
| Chipset | Q370/H310 | |||||
| BIOS | AMI 256Mb SPI Flash | |||||
|
8th/9th Generation Processor (TDP 65W) |
CPU | I7-9700E I5-9500E I3-9100E i7-8700 i5-8500 | i3-8100 | G5400 | G4900 | |
| Core/Thread number | 8/8 6/6 4/4 6/12 6/6 | 4/4 | 2/4 | 2/2 | ||
| Base Frequency | 2.6GHz 3.0GHz 3.1GHz 3.2GHZ 3.0GHz | 3.6GHz | 3.7GHz | 2.9GHz | ||
| Max Turbo Frequency | 4.4GHz 4.2GHz 3.7GHz 4.6GHz 4.1GHz | |||||
| L3 Cache | 12MB 8MB 6MB 12MB 9MB | 6MB | 4MB | 2MB | ||
| Temperature | -10 ~ 40 °C (w/ industrial wide-temp SSD, 0.7m/s air flow) | |||||
| Chipset | Q370/H310 | |||||
| BIOS | AMI 256Mb SPI Flash | |||||
|
Memory |
Technology | Dual-channel DDR4 2400/2666 MHz (without ECC) | ||||
| Socket | 2 x 260-pin DDR4 SODIMM (up to 32GB per socket) | |||||
| Maximum Capacity | 64GB | |||||
|
Display |
Chipset | Q370: Intel® HD Graphics 630, supports DirectX 12 H310: Intel® HD Graphics 610, supports DirectX 12 | ||||
| VGA | 1 x DB15, up to 1920 x 1200 maximum resolution | |||||
| HDMI | 1 x HDMI, up to 4096 x 2160@30Hz | |||||
| Multiple Display | Q370: 3 x independent displays (with Flex I/O for 2nd HDMI, 1 x DVI or 1 x DP) H310: 2 x independent displays | |||||
|
Ethernet |
Controller | Q370 LAN1: Intel® I219LM, LAN2: Intel® i210IT H310 LAN1: Intel® I219V, LAN2: Intel® i210IT | ||||
| Interface | 2 x RJ45 | |||||
|
Storage |
HDD | 1 x 2.5" HDD/SSD (up to 2 x 2.5" SSD by optional kit; 2 x 3.5" HDD by i-Module) | ||||
| mSATA | 1 | |||||
| RAID | 0/1/5/10 (Q370 SKU only) | |||||
| SATA Conn. | Q370: 3 x SATA signal, 3 x SATA power H310: 2 x SATA signal, 2 x SATA power | |||||
|
I/O |
USB | Q370: 2 x USB3.1, 6 x USB3.0 and 1 x internal USB 2.0
H310: 4 x USB 3.0 and 4 x USB 2.0 |
||||
| Serial Port | 2 x DB9, 2 x RS-232/422/485 support auto flow control; 4 x RS-232 (Optional) | |||||
| Audio | 2 (1 x line out and 1 x mic in) | |||||
|
Expansion |
Module | Supports Advantech i-Modules | ||||
| Mini PCIe | Q370: 1 x mini PCIe (via USIM), 1 x mini PCIe/mSATA H310: 1 x mini PCIe (via USIM), 1 x mSATA | |||||
|
LED and Switch |
LED | 2 (1 x Storage and 1 x Power), 4 for COM1 TX/RX and COM2 TX/RX | ||||
| Button | 1 x Power on/off switch | |||||
| Remote Switch | Yes, 2pin terminal block (Optional) | |||||
|
Power |
Type | ATX/AT | ||||
| Input Voltage | 9 ~ 36 VDC | |||||
| Power consumption | Typical: 32.1W Maximum: 116W | |||||
| Watchdog Timer | Output | System reset | ||||
| Interval | Programmable 1 ~ 255 sec/min | |||||
|
Environment |
Temperature 65W CPU w/ industrial wide-temp SSD 35W CPU w/ industrial wide-temp SSD Non-operating | |||||
| -10 ~ 40 °C with 0.7 m/s air flow -10 ~ 50 °C with 0.7 m/s air flow -40 ~ 85 °C | ||||||
| Humidity | 95% @ 40 °C (non-condensing) | |||||
| Vibration | With SSD: 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis
With 2.5" HDD: 1 Grms @ 5 ~ 500 Hz, random, 1 hr/axis |
2G | ||||
| Shock | With SSD: 20G, IEC-68-2-27, half-sine wave, 11 ms duration | 50G 11 ms | ||||
|
Mechanical |
Dimensions (W x H x D) | 77 x 192 x 230 mm (3.07" x 7.55" x 9.05") | ||||
| Weight | 2.8 kg (6.17 lbs) | |||||
| Installation | Desktop/wall mount | |||||
| Certifications | EMC | CE/FCC Class A, CCC, BSMI | ||||
| Safety | CB/UL, CCC, BSMI | |||||
| OS Support | Windows 10, Windows 10 IoT, Linux OS | |||||
Ordering Information
| Part Number | VGA | HDMI | 2.5" HDD/SSD | mSATA | USB 3.1 | USB 3.0 | USB 2.0 | GbE | COM | PCIe | Power |
| MIC-770Q-00A2 | 1 | 1 | 1 | 1 | 2 | 6 | 0 | 2 | 2, up to 6 (Optional) | i-Module (optional) | 9 ~ 36VDC |
| MIC-770H-00A2 | 1 | 1 | 1 | 1 | 0 | 4 | 4 | 2 | 2, up to 6 (Optional) | i-Module (optional)* | 9 ~ 36VDC |
*MIC-770H does not support MIC-75M40, MIC-75M20-01 and MIC-75G30
Packing List
| Part Number | Description | Quantity |
| MIC-770 | MIC-770 barebone system | 1 |
| 2041077000 | MIC-770 startup manual (ENG+TC+SC) | 1 |
| 1652003234 | 4-pin Phoenix power connector | 1 |
| 1960070543T005 | 2 x Mounting bracket | 2 |
| 1700013095-01 | SATA cable | 1 |
| 1700024372-01 | SATA power cable | 1 |
| 2170000093-01 | CPU thermal grease | 1 |
| 1990019498N000 | RAM thermal pad | 2 |
Optional i-Modules*
| Part Number | Description |
| MIC-75M10-00A2 | 1-slot expansion module (1 x PCIe) |
| MIC-75M11-00B1 | 2-slot expansion module (1 x PCIe and 1 x PCI slots) |
| MIC-75M13-00B1 | 4-slot expansion module (1 x PCIe and 3 x PCI slots) |
| MIC-75M20-00C1 | 2-slot expansion module (2 x PCIe slots) |
| MIC-75M20-01A2** | 2-slot expansion module (2 x PCIe slots) |
| MIC-75M40-00A2** | 4-slot expansion module (4 x PCIe slots) |
| MIC-75G20-10B1 | GPU card expansion module (2 x PCIe and 2 x removable 2.5" storage bay) |
| MIC-75G30-00B1** | Dual GPU card expansion module (3 x PCIe and 2 x removable 2.5" storage bay) |
| MIC-75GF10-00A1 | MXM GPU expansion module (1 x PCIe and
2 x removable 2.5" storage bay, 1 x HDMI, 3 x DP) |
| MIC-75S00-00A1 | 2 x removable 2.5" storage bay |
| MIC-75S20-00A2 | 2-slot expansion and storage module (2 x PCIe and 2 x removable 2.5" storage bay) |
| 98R17520301 | 2 x 3.5" HDD kit |
*Please refer to i-Module datasheet for more detail.
** Q370 SKU only
Embedded OS
| Part Number | Description |
| 20706WX9HS0005 | img MIC-770H Win10 IOT Enterprise 2019 LTSC 64b high end |
| 20706WX9VS0007 | img MIC-770H Win10 IOT Enterprise 2019 LTSC 64b value |
| 20706WX9ES0010 | img MIC-770H Win10 IOT Enterprise 2019 LTSC 64b entry |
| 20706WX9HS0004 | img MIC-770Q Win10 IOT Enterprise 2019 LTSC 64b high end |
| 20706WX9VS0006 | img MIC-770Q Win10 IOT Enterprise 2019 LTSC 64b value |
| 20706WX9ES0009 | img MIC-770Q Win10 IOT Enterprise 2019 LTSC 64b entry |
Optional Accessories
| Part Number | Description |
| Adaptor | |
| 96PSA-A230W24P4-3* | ADP A/D 100-240V 230W 24V C14 TERMINAL BLOCK 4P |
| 96PSA-A150W19P4-3 | ADP A/D 100-240V 150W 19V C14 TERMINAL BLOCK 4P |
| 1702002600 | Power cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D |
| 1700000237-31 | Power Cord PSE 3P 12A 125V 183cm |
| 1702002605 | Power Cord (EU), 3-pin, 10A, 250V 1.83M, 90D |
| Din Rail PSU | |
| 96PSD-A240W24-MN | A/D 100-240V 240W 24V NDR DIN RAIL |
| 1700031170-01 | DC-DC power cord, A cable TEM*4/TEM*4 UL2464 18AWG 150cm |
| 1700029720-01 | AC-DC power cord (US), M cable AC CONN 3P 183cm |
| 1700030520-01 | AC-DC power cord (CN), M cable conn 3P CCC 10A 250V 150cm |
| 1700034561-01 | AC-DC power cord (EU), M cable Type E 3P/TEMx3 80CM |
Optional Flex I/O* & Kits
| Part Number | Description |
| Flex I/O | |
| AIIS-DIO32-00A1E** | AIIS GPIO module (32 bit) |
| PCA-TPM-00B1E | TPM 2.0 module |
| 98R17500001 | MIC DVI FIO |
| 98R17500101 | MIC HDMI/Remote power on/off FIO |
| 98R17500301 | MIC HDMI kit FIO |
| 98R17500401 | MIC Remote power on/off FIO |
| 98R17500601 | MIC COMport kit FIO (4x COM RS-232 via 2x dual DB9 cable) |
| 98R17500701 | MIC Remote power on/off kit for SFIO |
| 98R17500801 | MIC Reset/Remote power on/off/5VDC kit FIO |
| 98R17500901 | MIC GPIO kit FIO |
| Advanced Flex I/O*** | |
| 98910770301 | MIC NVMe + 4 LAN Advanced FIO |
| 98910770401 | MIC NVMe Advanced FIO |
| 98910770501**** | MIC 4 PoE Advanced FIO |
| Storage Kit | |
| 98R1752010E | 2nd 2.5" HDD/SSD kit (used in 2-slot i-Module) |
| 98R1752020E | 2 x 2.5" SSD kit (Thickness: 7mm, used insides of MIC-770 V2) |
| Mounting Kit | |
| 98R17500210 | MIC Din Rail Mounting kit |
| 98R17500501 | MIC Wall Mounting kit |
| Fan Kit | |
| 98R17501303 | MIC Fan Kit |
** Can only be placed in the small FIO location and can’t be installed with other flex IO.
*** Q370 SKU only
**** Can't be installed with other flex IO.
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