| Model | NVIDIA® Jetson AGX Orin™ | ||
| MIC-733-AO5A1 | MIC-733-AO6A1 | ||
| Processor | NVIDIA Jetson Series | AGX Orin 32G | AGX Orin 64G |
| CPU | 8-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 |
12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 3MB L2 + 6MB L3 |
|
| GPU | 1792-core NVIDIA Ampere GPU with 56 Tensor Cores, Maximum Operating Frequency: 930 MHz |
2048-core NVIDIA Ampere GPU with 64 Tensor Cores] Maximum Operating Frequency: 1.3GH |
|
| Al Performance Reference | Up to 200 TOPs | Up to 275 TOPs | |
| Memory | 32GB 256-bit LPDDR5 DRAM | 64GB 256-bit LPDDR5 DRAM | |
| I/O | Ethernet | 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at) | |
| Display | HDMI (Max. resolution 3840x2160 @ 60Hz) | ||
| USB | External: 2 x USB 2.0, 4 x USB 3.2 Gen 2 | ||
| Internal: 1 x USB 2.0 | |||
| Digital I/O | 4-ch DI, 4-ch DO | ||
| Power Switch | 1 x Power ON/OFF Button | ||
| Serial Ports | 2 x RS-232/422/485 (On-board pin header) | ||
| OTG USB | 1 x Micro USB | ||
| Expansion | iModule (Optional) | 1 x PCIe x8 (MIC-75M10-00A2) | |
| Mini PCIe | 2 x mPCIe (Signal: PCIe+USB) | ||
| SIM | 2 x Nano SIM slots | ||
| M.2 | 1 x M.2 3052 (B-Key, Signal: USB) | ||
| TPM (Optional) | 1 x TPM 2.0 | ||
| GMSL (Optional) | 2-ch GMSL2.0 with FAKRA connectors | ||
| iDoor (Optional) | 1 x iDoor bracket reserve | ||
| Storage | M.2 | 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4) | |
| SD Card | 1 x Micro SD slot | ||
| Power | Mode | AT/ATX (Default AT) | |
| Input Voltage | 9 ~ 36 VDC, 16-4A | ||
|
Environment |
Operating Temperature | -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode) | |
| Operating Humidity | 95% @ 40 °C (non-condensing) | ||
| Vibration | 3Grms @ 5 ~ 500 Hz, random, 1 hr/axis | ||
| Shock | 10G / 11 ms | ||
| Mechanical | Dimensions (W x D x H) | Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43") | |
| Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37") | |||
| Weight | 4.5 kg (9.9 lb) | ||
| Installation | Desktop / Wall mount | ||
| BSP | Jetpack | Above 5.0 | |
| Certifications | UL/CB/CE/FCC/BSMI/CCC (No RED certification) | ||
*Depending on the installation situation and interface connection. Derating of max. operating temp. is possible when using the cellular LTE module. Please see the user documentation.
| Part Number | NVIDIA Module | Memory | eMMC | NVMe |
| MIC-733-AO5A1 | AGX Orin | 32 GB | 64 GB | N/A |
| MIC-733-AO6A1 | AGX Orin | 64 GB | 64 GB | N/A |
| Part Number | Description | Quantity |
| MIC-733-AO | AI Inference System | 1 |
| 1652003234 | Power terminal block 4P | 1 |
| 1652005204 | DI/DO terminal block 5P | 2 |
| 1700023619-01 | Micro USB cable for system recovery | 1 |
| 1960070543T00A | Mounting bracket | 2 |
| 1960107065N000 | M.2 mPCIe heat spreader bracket | 1 |
Remote Management Enrollment
Enroll in 24/7 secure service to get all the features of remote device management on one centralized cloud portal - Allxon Portal.
*Supports JetPack 4.4 GA and above
Enrollment Page: https://allxon.com/jetson/device_enroll/
| Part Number | Description | Quantity | |
| SSD | 96FD80-P1TB-TS1 | SSSTC M.2 2280 1TB NVME G4x4 SSD -25°C ~85°C | 1 |
| SQF-C8MV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) | 1 | |
| SQF-C8MV4-1TDEFM | SQF M.2 2280 730-D 1T 3D TLC BiCS5 (-20~85°C) | 1 | |
| SQF-C8MZ2-128GDEDE | SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) | 1 | |
| SQF-C8MV2-512GDEDE | SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-40~85°C) | 1 | |
| SQF-C8MV2-512GDEFE | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-40~85°C) | 1 | |
| SQF-C8MV2-512GDEFN | SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-20~85°C) | 1 | |
| SQF-C8MV4-2TDEDC | SQF M.2 2280 720-D 2T 3D TLC BiCS5 (0~70°C) | 1 | |
| SQF-C8MV2-128GDEDM | SQF M.2 2280 720-D 128G 3D TLC BiCS5 (-20~85°C) | 1 | |
| SQF-C8MV2-512GDEDM | SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85°C) | 1 | |
| SQF-C8BV4-1TDEDC | SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) | 1 | |
| Wifi | EWM-W173H01E | Wi-Fi 6+BT 5.0 Module 2.4/5GHz Mini PCIe | 1 |
| EWM-W172H01E | Wi-Fi 5+BT 4.2 Module 2.4/5GHz Mini PCIe | 1 | |
| 1751000626-01 | Cable Ant. SMA/F-R MHF1/113 BLK L250mm | 2 | |
| 1751000460-01 | Dipole Ant. WiFi 6E SMA/M-R BLK L111.7mm IP54 | 2 | |
| 9656EWMG00E | Half-size miniPCIe to miniPCIe bracket set | 1 | |
| 5G | AIW-356-DQ | 5G Sub6+GNSS M.2 3052 Key B (by region) | 1 |
| 1751000623-01 | Cable Ant. SMA/F MHF4L/113 BLK L300mm (5G) | 4 | |
| 1750009372-01 | Ant.SMA/M 90/180 5G BLK 167mm RG178 (5G) | 4 | |
| Power Cord | 1702002600 | Power Cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D | 1 |
| 1700029019-01 | Power Cord (PSE/BSMI), 3-pin, 7A, 125V, 1.8 M, DAC-ST01 | 1 | |
| 1702002605 | Power Cord EU 3P 10A 250V C13 183cm (EU) | 1 | |
| iDoor Accessory | 1960065854N021 | PCM series module bracket for supporting idoor cover fixing | 1 |
| TPM 2.0 | PCA-TPMSPI-00A1 | TPM 2.0 Module by SPI interface | 1 |
For the PCM module application, please use the iDoor cover on the MIC-733 front window.