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MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO
MIC-733-AO

MIC-733-AO

基于NVIDIA® Jetson AGX Orin™ 推理平台

  • 无风扇设计
  • 基于NVIDIA® Jetson AGX Orin™ 算力高达 275 TOPS
  • 支持 4x GbE (可选 PoE), 4 x USB 3.2 Gen2 (10Gbit/s)
  • 支持2 x mPCIe, 2 x Nano SIM 插槽
  • 支持 4x GbE (可选 PoE, IEEE 802.3af/at)
  • 支持PCIex8 附加卡
  • 支持 Allxon 24×7 远程管理 OTA部署; Azure 认证设备
MIC-733 _ 技术规格

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Specifications

Model NVIDIA® Jetson AGX Orin™
MIC-733-AO5A1 MIC-733-AO6A1
Processor NVIDIA Jetson Series AGX Orin 32G AGX Orin 64G
CPU 8-core NVIDIA Arm® Cortex A78AE v8.2
64-bit CPU, 2MB L2 + 4MB L3
12-core NVIDIA Arm® Cortex A78AE v8.2
64-bit CPU, 3MB L2 + 6MB L3
GPU 1792-core NVIDIA Ampere GPU with 56 Tensor
Cores, Maximum Operating Frequency: 930 MHz
2048-core NVIDIA Ampere GPU with 64 Tensor
Cores] Maximum Operating Frequency: 1.3GH
Al Performance Reference Up to 200 TOPs Up to 275 TOPs
Memory 32GB 256-bit LPDDR5 DRAM 64GB 256-bit LPDDR5 DRAM
I/O Ethernet 4 x 10/100/1000 Mbps (Optional PoE support, IEEE 802.3af/at)
Display HDMI (Max. resolution 3840x2160 @ 60Hz)
USB External: 2 x USB 2.0, 4 x USB 3.2 Gen 2
Internal: 1 x USB 2.0
Digital I/O 4-ch DI, 4-ch DO
Power Switch 1 x Power ON/OFF Button
Serial Ports 2 x RS-232/422/485 (On-board pin header)
OTG USB 1 x Micro USB
Expansion iModule (Optional) 1 x PCIe x8 (MIC-75M10-00A2)
Mini PCIe 2 x mPCIe (Signal: PCIe+USB)
SIM 2 x Nano SIM slots
M.2 1 x M.2 3052 (B-Key, Signal: USB)
TPM (Optional) 1 x TPM 2.0
GMSL (Optional) 2-ch GMSL2.0 with FAKRA connectors
iDoor (Optional) 1 x iDoor bracket reserve
Storage M.2 1 x M.2 2280 (M-Key, NVMe, Signal: PCIe x4)
SD Card 1 x Micro SD slot
Power Mode AT/ATX (Default AT)
Input Voltage 9 ~ 36 VDC, 16-4A
 

Environment

Operating Temperature -10 ~ +60 °C with 0.7 m/s airflow (MaxN mode)
Operating Humidity 95% @ 40 °C (non-condensing)
Vibration 3Grms @ 5 ~ 500 Hz, random, 1 hr/axis
Shock 10G / 11 ms
Mechanical Dimensions (W x D x H) Core Module: 192 x 230 x 87 mm (7.55" x 9.05" x 3.43")
Plus MIC-75M10: 192 x 230 x 111 mm (7.55" x 9.05" x 4.37")
Weight 4.5 kg (9.9 lb)
Installation Desktop / Wall mount
BSP Jetpack Above 5.0
Certifications UL/CB/CE/FCC/BSMI/CCC (No RED certification)

*Depending on the installation situation and interface connection. Derating of max. operating temp. is possible when using the cellular LTE module. Please see the user documentation.

 

Ordering Information

Part Number NVIDIA Module Memory eMMC NVMe
MIC-733-AO5A1 AGX Orin 32 GB 64 GB N/A
MIC-733-AO6A1 AGX Orin 64 GB 64 GB N/A

 

Packing List

Part Number Description Quantity
MIC-733-AO AI Inference System 1
1652003234 Power terminal block 4P 1
1652005204 DI/DO terminal block 5P 2
1700023619-01 Micro USB cable for system recovery 1
1960070543T00A Mounting bracket 2
1960107065N000 M.2 mPCIe heat spreader bracket 1

Remote Management Enrollment

Enroll in 24/7 secure service to get all the features of remote device management on one centralized cloud portal - Allxon Portal.

*Supports JetPack 4.4 GA and above

Enrollment Page: https://allxon.com/jetson/device_enroll/

 

Optional

Part Number Description Quantity
SSD 96FD80-P1TB-TS1 SSSTC M.2 2280 1TB NVME G4x4 SSD -25°C ~85°C 1
SQF-C8MV4-1TDEDC SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) 1
SQF-C8MV4-1TDEFM SQF M.2 2280 730-D 1T 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MZ2-128GDEDE SQF M.2 2280 720-D 128G 3D sTLC BiCS5 (-40~85°C) 1
SQF-C8MV2-512GDEDE SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-40~85°C) 1
SQF-C8MV2-512GDEFE SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-40~85°C) 1
SQF-C8MV2-512GDEFN SQF M.2 2280 730-D 512G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MV4-2TDEDC SQF M.2 2280 720-D 2T 3D TLC BiCS5 (0~70°C) 1
SQF-C8MV2-128GDEDM SQF M.2 2280 720-D 128G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8MV2-512GDEDM SQF M.2 2280 720-D 512G 3D TLC BiCS5 (-20~85°C) 1
SQF-C8BV4-1TDEDC SQF M.2 2280 720-D 1T 3D TLC BiCS5 (0~70°C) 1
Wifi EWM-W173H01E Wi-Fi 6+BT 5.0 Module 2.4/5GHz Mini PCIe 1
EWM-W172H01E Wi-Fi 5+BT 4.2 Module 2.4/5GHz Mini PCIe 1
1751000626-01 Cable Ant. SMA/F-R MHF1/113 BLK L250mm 2
1751000460-01 Dipole Ant. WiFi 6E SMA/M-R BLK L111.7mm IP54 2
9656EWMG00E Half-size miniPCIe to miniPCIe bracket set 1
5G AIW-356-DQ 5G Sub6+GNSS M.2 3052 Key B (by region) 1
1751000623-01 Cable Ant. SMA/F MHF4L/113 BLK L300mm (5G) 4
1750009372-01 Ant.SMA/M 90/180 5G BLK 167mm RG178 (5G) 4
Power Cord 1702002600 Power Cord (USA) UL/CSA, 3-pin, 10A, 125V, 1.83 M, 180 D 1
1700029019-01 Power Cord (PSE/BSMI), 3-pin, 7A, 125V, 1.8 M, DAC-ST01 1
1702002605 Power Cord EU 3P 10A 250V C13 183cm (EU) 1
iDoor Accessory 1960065854N021 PCM series module bracket for supporting idoor cover fixing 1
TPM 2.0 PCA-TPMSPI-00A1 TPM 2.0 Module by SPI interface 1

For the PCM module application, please use the iDoor cover on the MIC-733 front window.

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