MIC-3812V2

3U 紧凑型PCI® 串行 MXM 承载卡

3U 高度 CompactPCI 串行接口外设板
适用于 MXM 3.1 图形模块的载板
前面板上配备 2 个 HDMI 和 2 个 DisplayPort 接口
支持 Type A（82 mm x 70 mm）、Type B 和 Type B+（82 mm x 105 mm）MXM 图形模块，基于 NVIDIA Turing 和 Ampere 架构
专为满足 EN50121-4、EN50121-3-2 和 EN50155 标准而设计
符合 PICMG CompactPCI 串行（CPCI-S.0 R2.0）标准

MIC-3812V2_ 技术规格

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Specifications

Interface	Carrier board for Type A, Type B or Type B+ MXM 3.1 graphics module
Backplane Interface	2 x DP(switch to front HDMI1/DP1) to backplane via P2 and P3 connectors, customizable by user request
Front Panel	2 x HDMI 2.0 2 x DisplayPorts 1.4a
Dimension	3U/8HP, 100 x 160mm Weight: 660g
OS support	Windows 10 , Linux Centos(Dependent on MXM module)
Environment		Operating	Non-Operating
	Temperature	-40 ~ 70° C (-40°F ~ 158°F) (dependent on MXM module and heatsink solution)	-40 ~ 85° C (-40 ~ 176° F)
	Humidity	95% @ 40°C, non-condensing	95% @ 60°C, non-condensing
	Vibration	2 Grms, random (5 Hz ~ 500 Hz)
	Shock	10 G, 11 ms, each axis three times, operation mode

Ordering Information

Note:

CPU board	Description
MIC-330 Series	3U CPCI-Serial Intel® 9th Gen. Processor Blade
MIC-330V2 Series	3U CPCI-Serial Intel® 11th Gen. Processor Blade
MIC-3821 Series	3U CPCI-Serial quad M.2 M-Key NvME carrier board
MIC-300A Series	3U CPCI-Serial 84HP/44HP width, 3U/4U height chassis, with 8 slots backplane & mini fan
MIC-3890DC	3U CPCI-Serial DC-DC power module, module, 110V in / 12V out, 300W
MIC-3890AC	3U CPCI-Serial AC-DC power module, 12 V & 5 V output, 300 W