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Specifications
| Connect Type | NGFF M Key |
| Flash type | 3D TLC |
| Capacity | 256GB ~ 512GB |
| Transfer Mode | PCIe Gen.4 x4 |
| Max. Power Consumption | Read: 5.2 W, Write: 3.8 W |
| Sequential R/W Performance (*) | up to 4,900/ 3,300 MB/sec |
| Operating Temperature | Commercial grade: 0 to +70 °C Industrial grade: -40 to +85 °C |
| Shock Resistance | 1,500 G, peak / 0.5 ms |
| Vibration Resistance | 20 G, peak / 80 ~ 2000 Hz |
| Dimensions (mm) | 30.0 x 22.0 x 2.15 |
(*) These values are for reference only; they may change according to the flash memory used.
Ordering Information
| PN | Description |
| SQF-C3MV1-256GDEFC | SQF PCIe/NVMe Gen.4 M.2 2230 OPAL 730-D 256G 3D TLC BiCS5 (0~70°C) |
| SQF-C3MV1-512GDEFC | SQF PCIe/NVMe Gen.4 M.2 2230 OPAL 730-D 512G 3D TLC BiCS5 (0~70°C) |
| SQF-C3MV1-256GDEFE | SQF PCIe/NVMe Gen.4 M.2 2230 OPAL 730-D 256G 3D TLC BiCS5 (-40~85°C) |
| SQF-C3MV1-512GDEFE | SQF PCIe/NVMe Gen.4 M.2 2230 OPAL 730-D 512G 3D TLC BiCS5 (-40~85°C) |