Specifications
Form Factor | Form Factor | COM Express Basic Module |
Pin-out Type | COM Express R3.0 Type 7 compatible | |
Processor System |
CPU | Xeon D-1539 |
Base Frequency | 1.6 GHz | |
Max Single Core Turbo Frequency | 2.2 GHz | |
Cores | 8 | |
LLC | 12MB | |
CPU TDP | 35W | |
BIOS | AMI UEFI 128Mbit | |
Memory |
Technology | DDR4 2133MHz |
ECC Support | ECC | |
Max. Capacity | up to 32GB | |
Memory Type | Solder-down memory | |
Storage | Capacity | 16GB |
Type | Solder-down SSD | |
Expansion |
PCI Express x16 | 1 PCIe x16 Gen.3, and bifurcatable to 2 x8, 1 x8 & 2 x4, or 4 x4 |
PCI Express x8 | 1 PCIe x8 Gen.3, and bifurcatable to 2 x4 | |
PCI Express x1 | 7 Ports, PCIe x1 Gen.2, and bifurcatable to x2 or x4 (max. 8 Ports if remove GbE LAN) | |
LPC | Yes. 33MHz, support DMA read/write | |
Serial Bus | SMBus | Yes |
I2C Bus | Support 100Kb/s & 400Kb/s devices. Default master mode, optional slave mode | |
Ethernet | 10GB Ethernet | Intel integrated 2x 10G LAN contorller; Interface: 10GBase-KR |
Gigabit | Intel I210AT/I210IT controller; Speed: 10/100/1000 Mbps | |
I/O |
SATA | 2 ports support SATA III 6.0Gb/s |
USB3.0 | 4 Ports | |
USB2.0 | 4 Ports | |
SPI Bus | Yes. for BIOS ROM | |
GPIO | 8-bit GPIO | |
Watchdog | 65536 level, 0 ~ 65535 sec | |
COM Port | 2 Ports (2-Wire) | |
TPM | TPM 2.0 w/ 128 or 256bit (n/a) secured | |
Smart Fan | 2 Ports; 1 Port on COM Module. Support 12V Fan, 1 Port on Carrier Board | |
Power |
Type | ATX: Vin, VSB, AT: Vin |
Supply Voltage | Vin: 8.5 (9-5%) ~ 20V (19+5%), VSB: 5V±5%, RTC Battery: 2.0-3.3V | |
Power Consumption (Max.) | 46.6W | |
Power Consumption (Idle) | 12.8W | |
Environment |
Temperature |
Operating Temp.: 0 ~ 60 °C (32 ~ 140 °F)
Extend Temp. : -40 ~ 85 °C (-40 ~ 185 °F) with 0.7m/s air flow Storage: -40 ~ 85 °C (-40 ~ 185 °F) High/Low Temperature Operation Test Test Standard: Reference MIL-STD-810G testing procedures Table 501.6-II (Basic Hot (A2)) Table 502.6-I (Cold (C2)) |
Humidity |
Operating: 40 °C @ 95% relative humidity, non-condensing Storage: 60 °C @ 95%relative humidity, non-condensing
Humidity Test Test Standard: Reference MIL-STD-810G testing procedures Table 507.6-I (Hot Hunid (B3)) High/Low Temp. Storage Test Test Standard: Reference MIL-STD-810G testing procedures Table 501.6-II (Basic Hot (A2)) Table 502.6-I (Cold (C2)) |
|
Vibration Resistance | Test Standard: MIL-STD-810G testing procedures Figure 514.7C-4 (Category 4), Table 514.7C-V | |
Shock | Test Standard: Reference MIL-STD-810G testing procedures Figure 516.7-10, Table 516.7-IV | |
Altitude | Test Standard: Reference MIL-STD-810G testing procedures Method 500.6 | |
Mechanical | Dimensions | 125 x 95 mm (4.92" x 3.74") |
Ordering Information
Part No. | CPU | Core | Freq. | CPU TDP | LLC | Memory | SSD | Giga LAN | 10GBase-KR | PEG
x16 |
PCIe
x8 |
PCIe
x1 |
USB 2.0 | USB 3.0 | SATA III | LPC | Power | Thermal solution | Operating Temp. |
SOM-9590D8AAX-U0A1 | Xeon D-1539 | 8 | 1.6 | 35W | 12MB | ECC 16GB | 16GB | * 0/1 | 2 | 1 | 1 | * 7/8 | 4 | 4 | 2 | Yes | AT/ATX | Active | -40 ~ 85 °C |
* Other combination is project based support. Please contact sales for details.
Optional Accessories
Part No. | Description |
1960048820N001 | Semi-Cooler, 125L x 95W x 33.5H |
Packing List
Part No. | Description | Quantity |
- | SOM-9590 COM module | 1 |
1970004470T001 | Heatspreader | 1 |
Development Board
Part No. | Description |
SOM-DB5920-00A1 | COM-Express Development Board, Type 7 Pin-out (with EA60 2 ports RJ45) |
SOM-DB5920-F0A1 | COM-Express Development Board, Type 7 Pin-out (with EA61 2 ports SFP+) |
Embedded OS
OS | Part No. | Description |
Win10 | 2070015250 | Img Win10 IoT Ent_LTSB 64 bit |
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