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ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)
ECX-3200MX (M12)

ECX-3200MX (M12)

超恩(Vecow)ECX-3200MX (M12) 可扩展型嵌入式无风扇工控机,采用 R680E芯片组,支持14代英特尔® 酷睿™ i9/i7/i5/i3 处理器,可运行在 -40°C 至 75°C 工作温度,ECX-3200无风扇嵌入式系统是机器视觉、机器人行业、机车车辆、车载测控、车辆计算、AMR 和任何 AIoT/工业 4.0 的理想选择应用程序。

  • 第 14代英特尔® 酷睿™ i9/i7/i5/i3 处理器
  • 英特尔® R680E PCH,高达 65W TDP CPU
  • 2 个DDR5 5200MHz 内存,支持高达 96GB
  • 无风扇设计,支持-40°C至75°C 宽温工作温度
  • PCIe x 16  扩展支持高达  200W 功率预算
  • 32 个隔离 DIO、4 个 COM RS-232/422/485
  • 4个独立2.5G以太网口支持X-coded M12
  • 5G/WiFi/BT/4G/LTE/GPRS/UMTS通讯
  • 9V至50V直流输入,支持软件延缓开关机设定

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产品型号 产品类别 ECX-3200 (M12) ECX-3200 查看更多... ECX-3100 查看更多... ECX-2210MX 查看更多...
 

 

 

System

CPU Intel® Core™i9/i7/i5/i3 Processor (RPL-S/ADL-S) Intel® Core™i9/i7/i5/i3 Processor (RPL-S/ADL-S) Intel® Core™i9/i7/i5/i3 Processor (RPL-S/ADL-S) Intel® Xeon®/Core™i9/i7/i5/i3 Processor (CML-S)
Chipset Intel® R680E Intel® R680E Intel® R680E Intel® W480E
BIOS AMI AMI AMI AMI
Memory Type 260-pin SO-DIMM, DDR5 4800MHz 260-pin SO-DIMM, DDR5 4800MHz 260-pin SO-DIMM, DDR5 4800MHz 260-pin SO-DIMM, DDR4 2933MHz
Memory Capacity Max 64GB, 2 SO-DIMM Max 64GB, 2 SO-DIMM Max 64GB, 2 SO-DIMM Max 64GB, 2 SO-DIMM
Graphics Intel® UHD 770 Intel® UHD 770 Intel® UHD 770 Intel® UHD 630
Ethernet Intel® I219LM, Intel® I226 Intel® I219LM, Intel® I226 Intel® I219LM, Intel® I226 Intel® I219LM, Intel® I210, Intel® I350
Audio Realtek® ALC888S-VD Realtek® ALC888S-VD Realtek® ALC888S-VD Realtek ALC888S-VD
Super I/O IT8786E IT8786E IT8786E IT8786E
OS Support Windows 10, Linux Windows 10, Linux Windows 10, Linux Windows 10, Linux
 

Display I/O

VGA NA NA NA 1
DVI-I 1 1 1 NA
DVI-D NA NA NA 1
HDMI NA NA NA NA
LVDS NA NA NA NA
DisplayPort 2 2 2 2
 

 

 

I/O Interface

Serial 4 RS-232/422/485 4 RS-232/422/485 4 RS-232/422/485 4 RS-232/422/485
USB 3.0/3.1/3.2 - 6 USB 3.2 Type A

- 1 USB 3.2 Gen 2x2 Type C

-  6 USB 3.2 Type A

-  1 USB 3.2 Gen 2x2 Type C

-  6 USB 3.2 Type A

-  1 USB 3.2 Gen 2x2 Type C

6 (External)
USB 2.0 NA NA NA NA
GigE LAN 6 (5 port 2.5G, 4 w/PoE+) 6 (5 port 2.5G, 4 w/PoE+) 2 (1 port 2.5G) 6 (4 w/PoE+)
PoE LAN 4 2.5G PoE+ (IEEE 802.3at) 4 2.5G (IEEE 802.3at) NA 4 (IEEE 802.3at)
M12 4 2.5G (X-coded, PoE+) NA NA 4 (X-coded, PoE+)
Audio 1 Mic-in, 1 Line-out 1 Mic-in, 1 Line-out 1 Mic-in, 1 Line-out 1 Mic-in, 1 Line-out
GPIO NA NA 16 GPIO NA
Isolated DIO 32 (16 DI, 16 DO) 32 (16 DI, 16 DO) NA 32 (16 DI, 16 DO)
Others 2 SSD/HDD Tray (External) 2 SSD/HDD Tray (External) 2 SSD/HDD Tray (External) 2 SSD/HDD Tray (External)
 

 

Storage

SATA III 2 2 2 2
SATA II NA NA NA NA
CFast NA NA NA NA
mSATA NA NA NA 2 (Mini PCIe)
M.2 1 Key M 2280 1 Key M 2280 1 Key M 2280 1 Key M 2280
Micro SD NA NA NA 1 (External)
 

 

Expansion

Mini PCIe 1 1 1 2
PCIe 1 PCIe x16 1 PCIe x16 1 PCIe x16 1 PCIe x16
PCI NA NA NA NA
M.2 - 2 Key B 2280/3042/3052

- 1 Key E 2230

- 2 Key B 2280/3042/3052

- 1 Key E 2230

- 2 Key B 2280/3042/3052

- 1 Key E 2230

- 1 Key B 3042/3052

- 1 Key E 2230

SIM Card 3 (Nano SIM, External) 3 (Nano SIM, External) 3 (Nano SIM, External) 3 (Nano SIM, External)
SUMIT 2 (Optional) 2 (Optional) 2 (Optional) 2 (Optional)
 

Power

Input DC-in 9V to 50V DC-in 9V to 50V DC-in 9V to 50V DC-in 9V to 50V
Connector Terminal Block Terminal Block Terminal Block Terminal Block
Ignition Control Yes (SW IGN) Yes (SW IGN) Yes (SW IGN) Yes (SW IGN)
Remote Switch Yes Yes Yes Yes
Dimensions (W x L x H) 260 x 240 x 79 mm

(10.2" x 9.5" x 3.1")

260 x 240 x 79 mm

(10.2" x 9.5" x 3.1")

260 x 240 x 79 mm

(10.2" x 9.5" x 3.1")

260 x 240 x 79 mm

(10.2" x 9.45" x 3.1")

Weight 4.5 kg (9.92 lb) 4.5 kg (9.92 lb) 4.5 kg (9.92 lb) 4.5 kg (9.92 lb)
Mounting Wallmount, DIN Rail, 2U Rackmount Wallmount, DIN Rail, 2U Rackmount Wallmount, DIN Rail, 2U Rackmount Wallmount, DIN Rail, 2U Rackmount
Operating Temperature

Storage Temperature

-40°C to 75°C (-40°F to 167°F) -40°C to 75°C (-40°F to 167°F) -40°C to 75°C (-40°F to 167°F) -40°C to 75°C (-40°F to 167°F)
-40°C to 85°C (-40°F to 185°F) -40°C to 85°C (-40°F to 185°F) -40°C to 85°C (-40°F to 185°F) -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95%,

non-condensing

5% to 95%,

non-condensing

5% to 95%,

non-condensing

5% to 95%,

non-condensing

Vibration MIL-STD-810G, Procedure I MIL-STD-810G, Procedure I MIL-STD-810G, Procedure I IEC 60068-2-64
Shock MIL-STD-810G, Procedure I MIL-STD-810G, Procedure I MIL-STD-810G, Procedure I IEC 60068-2-27
Certification CE, FCC, EN50155, EN50121-3-2 CE, FCC, EN50155, EN50121-3-2 CE, FCC, EN50155, EN50121-3-2 CE, FCC, EN50155, EN50121-3-2
ECX-3200MX (M12)ECX-3200MX (M12)

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