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Specifications
Connect Type | NGFF M Key |
Flash type | 3D TLC |
Capacity | 400GB ~ 3.2TB |
Transfer Mode | PCIe Gen.4 x4 |
Max. Power Consumption | Read: 7.3 W, Write: 6.1 W |
Sequential R/W Performance (*) | up to 6,500/ 5,000 MB/sec |
Random R/W IOPS (*) | up to 779K/ 753K |
Endurance (DWPD) | Read-Intensive: DWPD 1
Mixed-Use: DWPD 3 |
Operating Temperature | Commercial grade: 0 to +70 °C
Industrial grade: -40 to +85 °C |
Shock Resistance | 1,500 G, peak / 0.5 ms |
Vibration Resistance | 20 G, peak / 80 ~ 2000 Hz |
Dimensions (mm) | 80.4 x 23.3 x 20.5 |
(*) These values are for reference only; they may change according to the flash memory used.
Ordering Information
PN | Description |
SQF-C8MV4-400GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 400G 3D TLC, DWPD 1 (0 ~ 70 °C) |
SQF-C8MV4-800GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 800G 3D TLC DWPD 1 (0 ~ 70 °C) |
SQF-C8MV4-1K6GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 1600G 3D TLC DWPD 1 (0 ~ 70 °C) |
SQF-C8MV4-3K2GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 3200G 3D TLC DWPD 1 (0 ~ 70 °C) |
SQF-C8MV4-400GDG1E | SQF PCIe/NVMe M.2 2280 ER-1 400G 3D TLC DWPD 1 (-40 ~ 85 °C) |
SQF-C8MV4-800GDG1E | SQF PCIe/NVMe M.2 2280 ER-1 800G 3D TLC DWPD 1 (-40 ~ 85 °C) |
SQF-C8MV4-1K6GDG1E | SQF PCIe/NVMe M.2 2280 ER-1 1600G 3D TLC DWPD 1 (-40 ~ 85 °C) |
SQF-C8MV4-3K2GDG1E | SQF PCIe/NVMe M.2 2280 ER-1 3200G 3D TLC DWPD 1 (-40 ~ 85 °C) |
SQF-C8MF4C400GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 400G 3D TLC DWPD 3 (0 ~ 70 °C) |
SQF-C8MF4C800GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 800G 3D TLC DWPD 3 (0 ~ 70 °C) |
SQF-C8MF4C1K6GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 1600G 3D TLC DWPD 3 (0 ~ 70 °C) |
SQF-C8MF4C3K2GDG1C | SQF PCIe/NVMe M.2 2280 ER-1 3200G 3D TLC DWPD 3 (0 ~ 70 °C) |
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