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Specifications
Connect Type | NGFF M Key |
Flash type | 3D TLC |
Capacity | 256GB ~ 4TB |
Transfer Mode | PCIe Gen.4 x4 |
Max. Power Consumption | Read: 5.1 W, Write: 4.8 W |
Sequential R/W Performance (*) | up to 4,900/ 3,700 MB/sec |
Operating Temperature |
Commercial grade: 0 to +70 °C Middle grade: -20 to +85 °C Industrial grade: -40 to +85 °C |
Shock Resistance | 1,500 G, peak / 0.5 ms |
Vibration Resistance | 20 G, peak / 80 ~ 2000 Hz |
Dimensions (mm) | 80.0 x 22.0 x 3.8 |
(*) These values are for reference only; they may change according to the flash memory used.
Ordering Information
PN | Description |
SQF-C8MV2-256GDEFC | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 256G 3D TLC BiCS5 (0~70°C) |
SQF-C8MV2-512GDEFC | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 512G 3D TLC BiCS5 (0~70°C) |
SQF-C8MV4-1TDEFC | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 1T 3D TLC BiCS5 (0~70°C) |
SQF-C8MV4-2TDEFC | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 2T 3D TLC BiCS5 (0~70°C) |
SQF-C8MV4-4TDEFC | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 4T 3D TLC BiCS5 (0~70°C) |
SQF-C8MV2-256GDEFM | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 256G 3D TLC BiCS5 (-20~85°C) |
SQF-C8MV2-512GDEFM | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 512G 3D TLC BiCS5 (-20~85°C) |
SQF-C8MV4-1TDEFM | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 1T 3D TLC BiCS5 (-20~85°C) |
SQF-C8MV4-2TDEFM | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 2T 3D TLC BiCS5 (-20~85°C) |
SQF-C8MV4-4TDEFM | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 4T 3D TLC BiCS5 (-20~85°C) |
SQF-C8MV2-256GDEFE | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 256G 3D TLC BiCS5 (-40~85°C) |
SQF-C8MV2-512GDEFE | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 512G 3D TLC BiCS5 (-40~85°C) |
SQF-C8MV4-1TDEFE | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 1T 3D TLC BiCS5 (-40~85°C) |
SQF-C8MV4-2TDEFE | SQF PCIe/NVMe Gen.4 M.2 2280 OPAL 730-D 2T 3D TLC BiCS5 (-40~85°C) |
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