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Specifications
Connect Type | NGFF A+E Key |
Flash type | 3D TLC |
Capacity | 128GB ~ 512GB |
Transfer Mode | PCIe Gen.3 x2 |
Max. Power Consumption | Read: 1.9 W, Write: 1.9 W |
Sustained R/W Performance (*) | up to 1,200/ 900 MB/sec |
Operating Temperature |
Commercial Temperature: 0 to +70 °C
Minus Temperature: -20 to +85 °C Extended Temperature: -40 to +85 °C |
Shock Resistance | 1,500 G, peak / 0.5 ms |
Vibration Resistance | 20 G, peak / 80 ~ 2000 Hz |
Dimensions (mm) | 30.0 x 22.0 x 3.8 |
(*) These values are for reference only; they may change according to the flash memory used.
Ordering Information
PN | Description |
SQF-C3AV1-128GDEDC | SQF PCIe/NVMe M.2 2230 OPAL 720-D 128G 3D TLC BiCS5 (0~70°C) |
SQF-C3AV1-256GDEDC | SQF PCIe/NVMe M.2 2230 OPAL 720-D 256G 3D TLC BiCS5 (0~70°C) |
SQF-C3AV1-512GDEDC | SQF PCIe/NVMe M.2 2230 OPAL 720-D 512G 3D TLC BiCS5 (0~70°C) |
SQF-C3AV1-128GDEDM | SQF PCIe/NVMe M.2 2230 OPAL 720-D 128G 3D TLC BiCS5 (-20~85°C) |
SQF-C3AV1-256GDEDM | SQF PCIe/NVMe M.2 2230 OPAL 720-D 256G 3D TLC BiCS5 (-20~85°C) |
SQF-C3AV1-512GDEDM | SQF PCIe/NVMe M.2 2230 OPAL 720-D 512G 3D TLC BiCS5 (-20~85°C) |
SQF-C3AV1-128GDEDE | SQF PCIe/NVMe M.2 2230 OPAL 720-D 128G 3D TLC BiCS5 (-40~85°C) |
SQF-C3AV1-256GDEDE | SQF PCIe/NVMe M.2 2230 OPAL 720-D 256G 3D TLC BiCS5 (-40~85°C) |
SQF-C3AV1-512GDEDE | SQF PCIe/NVMe M.2 2230 OPAL 720-D 512G 3D TLC BiCS5 (-40~85°C) |
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