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AIMB-278
AIMB-278
AIMB-278
AIMB-278

AIMB-278

研华AIMB-278 是一款高性能、带散热设计的 Mini-ITX 工业主板。支持 Intel 第12/13/14代 Core i系列处理器,搭载Q670E芯片组。独立四显,性能强劲,适用于医疗、视觉、检测仪器等行业上。

  • 支持Intel 第12/13代 Core i/奔腾系列处理器和Q670E芯片组
  • 2 x 260-pin SODIMM,支持可达64GB DDR5
  • 独立四显:2 x DP 1.4/HDMI/eDP,高达4K分辨率
  • 支持1 x PCIe x16 Gen5,1 x M.2 M key,1 x M.2 E key,8 x USB,3 x SATAIII,1 x GbE LAN,1 x 2.5GbE LAN
  • 支持TPM 2.0(可选)
  • 支持SUSI,DeviceOn和Edge AI Suite

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Specifications

 

 

14th Generation Processors

CPU i9-14900             i9-14900T            i7-14700             i7-14700T           i5-14500 i5-14500T i5-14400 i5-14400T i3-14100 i3-14100T
Core Number 24                    24                    20                    20                    14 14 10 10 8 8
Base frequency (GHz) 2.0/1.5               1.1/0.8                2.1/1.5               1.3/0.9               2.6/1.9 1.7/1.2 2.5/1.8 1.5/1.1 3.5/NA 2.7/NA
Max Speed (GHz) 5.8/4.3               5.5/4.0                5.4/4.2               5.2/3.7               5.0/3.7 4.8/3.4 4.7/3.5 4.5/3.2 4.7/NA 4.4/NA
Smart cache (MB) 36MB                36MB                 33MB                33MB                24MB 24MB 20MB 20MB 12MB 12MB
TDP (W) 65W                 35W                  65W                 35W                 65W 35W 65W 35W 65W 35W
 

 

 

13th Generation Processors

CPU i9-13900E /  i9-13900TE          i7-13700E /   i7-13700TE          i5-13500E /i9-13900 / i7-13700 / i5-13500 i5-13500TE i5-13400E/ i5-13400 i3-13100E / i3-13100 i3- 13100TE
Core Number 24                    24                    16                    16                    14 14 10 4 4
Base frequency (GHz) 1.8/2.0               1                     1.9/2.1                0.8                   2.4/2.6 1.3 2.4/2.5 3.3/3.4 2.4
Max Speed (GHz) 5.2/5.6               5                     5.1/5.2                4.8                   4.6/4.8 4.5 4.6 4.4/4.5 4.1
Smart cache (MB) 36                    36                    30                    30                    24 24 20 12 12
TDP (W) 65                    35                    65                    35                    65 35 65 60 35
 

 

 

12th Generation Processors

 

CPU

i9-12900E /     i9-12900TE         i7-12700E /     i7-12700TE         i5-12500E / i9-12900                     i7-12700  / i5-12500/12400  

i5-12500TE

i3-12100E / i3-12100  

i3-12100TE

 

G7400E

 

G7400TE

 

G6900E

 

G6900TE

Core Number 16                    16                    12                    12                    6 6 4 4 2 2 2 2
Base frequency (GHz) 2.3/2.4               1.1                    2.1                   1.4                   2.9/3.0/2.5 1.9 3.2 2.1 3.6 3 3 2.4
Max Speed (GHz) 5                     4.8                    4.8                   4.7                   4.5/4.6/4.4 4.3 4.2/4.3 4 NA NA NA NA
Smart cache (MB) 30                    30                    25                    25                    18 18 12 12 6 6 4 4
TDP (W) 65                    35                    65                    35                    65 35 60 35 46 35 46 35
Processor System Chipset Q670E / H610E
BIOS AMI EFI 256Mb SPI
Expansion Slot M.2                                  1 M-Key for SSD, 1 E-Key for Wireless connection
PCIe x16 PCIe x16 Gen5(32GT/s) for discrete GPU card and storage devices
 

Memory

Technology Dual Channel DDR5, up to 5600 MHz (non-ECC)
Max. Capacity 96GB (up to 48GB per SODIMM)
Socket 2 x 262pin SODIMM
 

 

 

Graphics

Controller up to Intel® UHD Graphics 770
HDMI HDMI2.0b, supports max. resolution 4096 x 2160 @ 60 Hz
DP DP1.4a, supports max. resolution 4096 x 2304 @ 60 Hz
eDP By Default, with internal pin header, supports max. resolution 4096 x 2304 @ 60 Hz
 

LVDS

By Option, internal pin header, supports singel/dual channel 18/24-bit with maximum resolution up to 1920 x 1200 @ 60 Hz

(eDP colay with LVDs)

Multi Displays up to 4 independent displays (combination of 2DP, 1HDMI, 1eDP)
 

Network

ETHERNET up to 2500 Mb/s
Controller Intel I219LM and Intel i226
Connector 2 x RJ45
SATA Max data transfer rate 600 MB/s
Channel 3 x SATAIII
 

 

Rear I/O

DP 2
HDMI 1
Ethernet 2
USB                                 Up to 6 USB3.2 (Q670E: 6 USB3.2 Gen2; H610E: 2 USB3.2 Gen1 (optional 2 USB3.2 Gen1) & 2 USB2.0)
Audio 1 (Line in/Line out/Mic in)
 

 

 

Internal Connector

USB 2 USB2.0
eDP/LVDS 1 eDP (LVDs colay with eDP)
Serial 2 (COM1 RS-232, COM2 RS232/422/485)
SATA 3
M.2                                  1 M-key (dimension: 2280)

1 E-key (dimension: 2230)

GPIO 6-bit
Watchdog Timer Output System reset
Interval Programmable 1 ~ 255 sec/min
Power Requirements Boost 92.7W
Typical 68.9W
Environment Temperature Operating: 0 ~ 60° C (32 ~ 140° F), depends on CPU speed and cooler solution
Storage Non-Operating: -40 ~ 85° C (-40 ~ 185° F)
Physical Characteristics Dimensions 170 mm x 170 mm (6.69" x 6.69")

 

Ordering Information

 

P/N Chipset HDMI LVDS/

eDP

DP GbE 2.5GbE COM SATAIII USB3.2 USB2.0 M.2 M key M.2 E key PCIex16 TPM AMP
AIMB-278Q-EAB1 Q670E 1 (1)/1 2 1 1 2 3 6 2 1 1 1 1 1
AIMB-278Q-LAB1 Q670E 1 1/(1) 2 1 1 2 3 6 2 1 1 1 1 1
AIMB-278H-EAB1 H610E (1) (1)/1 2 1 (1) 2 2 2/(2) 4 1 1 1 (1) (1)

*() Supports by BOM options

 

Packing List

Part Number Description Quantity
1700003194 SATA HDD cable 1
1700031130-01 1-to-2 serial port cable, 20cm 1
1960109548T001 I/O port bracket 1
2046027800 Startup manual for AIMB-278 1

 

Optional Accessory

Part Number Description
1700029719-01 M cable USB-A 9P(F)x2/2x10P-2.0 30CM USB3.0
1970005349T001 LGA1700 CPU Cooler H: 55.4mm (for TDP 65W)
1970005672T001 LGA1700 CPU Cooler H: 32mm (for TDP 35W)

 

Block Diagram

AIMB-278AIMB-278

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