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Specifications
Form Factor | SMARC2.0 & SMARC2.1 compliance | |
Processor System |
CPU | NXP i.MX 8DualXPlus (2 x Arm Cortex-A35) or 8QuadXPlus (4 x Arm Cortex-A35) 1.2GHz |
MCU | 1 x Arm Cortex-M4F core | |
DSP | 1 x Tensilica® HiFi 4 DSP | |
Memory |
Technology | LPDDR4 2400 MT/s |
Capacity | Onboard 2GB LPDDR4 | |
Flash | 16 GB eMMC NAND Flash for O.S. and 8 MB QSPI NOR Flash for board information | |
Graphics |
LVDS/MIPI DSI | 2 x 24-bit single channel LVDS 1080p or 2 x 4-LANE MIPI DSI |
HDMI | - | |
Parallel RGB | - | |
VGA | - | |
Graphics Engine | Vivante GC7000 Lite | |
H/W Video Codec | Supports H.265/H.264(4Kp30), WMV9/VC-1 imple, MPEG-1, MPEG-2, AVS, MPEG4.2 ASP, H.263 decode and
H.264(1080p30) encode |
|
Ethernet | Chipset | 2 x NXP i.MX8X integrated RGMII |
Speed | 2 x 10/100/1000 Mbps | |
RTC | RTC | Yes |
WatchDog Timer | 1~6553s, default 60s, power on/off 1s | |
Security | TPM 2.0 | |
I/O |
PCIe | 1 x PCIe 3.0 |
SATA | - | |
USB | 1 x USB 3.0, 1 USB 2.0 Host, 1 USB 2.0 OTG | |
Audio | 2 x I2S | |
SPDIF | - | |
SDIO | 1 | |
Serial Port | 1 x 4-wire UART and 2 x 2-wire UART | |
SPI | 2 | |
CAN | 2 x CAN bus 2.0 A/B | |
GPIO | 12 | |
I2C | 4 with interrupt | |
Camera Input | 1 x 4-lane MIPI CSI-2 | |
System Bus | - | |
Touch | - | |
Keypad | - | |
Power | Power Supply Voltage | 4.75~5.25V |
Power Consumption | 3.832W (Max) | |
Environment | Operating Temperature | 0 ~ 60 °C/ -40 ~ 85 °C |
Operating Humidity | 5 ~ 95% relative humidity, non-condensing | |
Mechanical | Dimensions (W x D) | 82 x 50 mm |
Operation System | Linux & Android | |
Certifications | CE/FCC Class B |
Ordering Information
Part No. | CPU | Memory | Flash Memory | UART | LAN | USB 3.0 | USB 2.0 | Display | PCIe 3.0 | SD | CANbus | I2C | SPI | Size | Power input | Operating Temperature |
ROM-5620CE-OEA2E | i.MX 8DualXPlus | 2GB | 16GB | 3 | 2 | 1 | 2 | 2x single channel 24-bit,
1x dual channel 48-bit LVDS or 2x 4-Lane MIPI-DSI by S/W Configuration |
1 | 1 | 2 | 4 | 2 | 82 x 50 mm | 4.75 ~ 5.25V | 0 ~ 60 °C |
ROM-5620WE-OEA2E | i.MX 8DualXPlus | 2GB | 16GB | 3 | 2 | 1 | 2 | 1 | 1 | 2 | 4 | 2 | 82 x 50 mm | 4.75 ~ 5.25V | -40 ~ 85 °C | |
ROM-5620CU-OEA2E | i.MX 8QuadXPlus | 2GB | 16GB | 3 | 2 | 1 | 2 | 1 | 1 | 2 | 4 | 2 | 82 x 50 mm | 4.75 ~ 5.25V | 0 ~ 60 °C | |
ROM-5620WU-OEA2E | i.MX 8QuadXPlus | 2GB | 16GB | 3 | 2 | 1 | 2 | 1 | 1 | 2 | 4 | 2 | 82 x 50 mm | 4.75 ~ 5.25V | -40 ~ 85 °C |
Development Board
Part No. | Description |
ROM-DB5901-SWA1 | Development board for SMARC v2.0 Arm-based Module series |
Optional Accessories
Part No. | Description |
1701100300 | Debug port cable for ROM-5620 |
1700019474 | D-SUB 9P(F)/D-SUB 9P(F) RS232/RS485 100c |
1970004483T001 | Heat Spreader for -40~85°C |
1960063089N001 | Semi Heat Sink for -40~85°C |
193B021490 | Screw for Heat Spreader and Semi Heat Sink |
96PSA-A36W12R1-3 | ADAPTER 100-240V 36W 12V 3A |
1700001524 | Power Cord 3P UL 10A 125V 180cm |
170203183C | Power Cord 3P Europe (WS-010+WS-083) 183cm |
170203180A | Power Cord 3P UK 2.5A/3A 250V 1.83M |
1700008921 | Power Cord 3P PSE 183cm |
SQF-ISDM1-16G-21C | SQF SD Card I-SD UHS-I MLC 16G (0~70°C) |
SQF-ISDM1-16G-21E | SQF I-SD UHS-I MLC 16G (-40~85°C) |
EWM-W163M201E | 802.11 a/b/g/n/ac,QCA6174A,2T2R,w/BT4.1,M.2 2230 |
1750008717-01 | Dipole Ant. D.B 2.4/5G WIFI 3dBi SMA/M-R BLK |
1750007965-01 | Antenna Cable R/P SMA (M) to MHF4, 300mm |
EWM-C117FL06E* | LTE 4G,3G WCDMA/DC-HSPA+, 2G module, MPCI-L280H |
1750007990-01 | Antenna 4G/LTE full band L=11 cm 50 Ohm |
1750006009 | Antenna Cable SMA (F) to MHF 1.32 25cm |
*Please contact us for suggesting suitable cellular module for your region.
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