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Specifications
Connect Type | NGFF B+M Key |
Flash type | 3D TLC |
Capacity | 128GB ~ 2TB |
Transfer Mode | PCIe Gen.3 x2 |
Max. Power Consumption | Read: 2.9 W, Write: 2.9 W |
Sustained R/W Performance (*) | up to 1,750/ 1,650 MB/sec |
Operating Temperature | Commercial Temperature: 0 to +70 °CMinus Temperature: -20 to +85 °CExtended Temperature: -40 to +85 °C |
Shock Resistance | 1,500 G, peak / 0.5 ms |
Vibration Resistance | 20 G, peak / 80 ~ 2000 Hz |
Dimensions (mm) | 80.0 x 22.0 x 3.8 |
(*) These values are for reference only; they may change according to the flash memory used.
Ordering Information
PN | Description |
SQF-C8BV2-128GDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-D 128G 3D TLC BiCS5 (0~70°C) |
SQF-C8BV2-256GDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-D 256G 3D TLC BiCS5 (0~70°C) |
SQF-C8BV2-512GDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-D 512G 3D TLC BiCS5 (0~70°C) |
SQF-C8BV4-1TDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-D 1T 3D TLC BiCS5 (0~70°C) |
SQF-C8BV4-2TDEDC | SQF PCIe/NVMe M.2 2280 OPAL 720-D 2T 3D TLC BiCS5 (0~70°C) |
SQF-C8BV2-128GDEDM | SQF PCIe/NVMe M.2 2280 OPAL 720-D 128G 3D TLC BiCS5 (-20~85°C) |
SQF-C8BV2-256GDEDM | SQF PCIe/NVMe M.2 2280 OPAL 720-D 256G 3D TLC BiCS5 (-20~85°C) |
SQF-C8BV2-512GDEDM | SQF PCIe/NVMe M.2 2280 OPAL 720-D 512G 3D TLC BiCS5 (-20~85°C) |
SQF-C8BV4-1TDEDM | SQF PCIe/NVMe M.2 2280 OPAL 720-D 1T 3D TLC BiCS5 (-20~85°C) |
SQF-C8BV4-2TDEDM | SQF PCIe/NVMe M.2 2280 OPAL 720-D 2T 3D TLC BiCS5 (-20~85°C) |
SQF-C8BV2-128GDEDE | SQF PCIe/NVMe M.2 2280 OPAL 720-D 128G 3D TLC BiCS5 (-40~85°C) |
SQF-C8BV2-256GDEDE | SQF PCIe/NVMe M.2 2280 OPAL 720-D 256G 3D TLC BiCS5 (-40~85°C) |
SQF-C8BV2-512GDEDE | SQF PCIe/NVMe M.2 2280 OPAL 720-D 512G 3D TLC BiCS5 (-40~85°C) |
SQF-C8BV4-1TDEDE | SQF PCIe/NVMe M.2 2280 OPAL 720-D 1T 3D TLC BiCS5 (-40~85°C) |
SQF-C8BV4-2TDEDE | SQF PCIe/NVMe M.2 2280 OPAL 720-D 2T 3D TLC BiCS5 (-40~85°C) |
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