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研华EPC-R5710 是一款基于NXP i.MX 8M Plus的AI边缘智能系统，集成2.3 TOPS AI算力,并且可扩展8-26 TOPS AI算力，支持8路MIC阵列，TPM,TCM加密，支持多种协议转换
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Specifications
|
Processor |
CPU/GPU | NXP i.MX 8M Plus Cortex-A53 Dual/Quad Core (up to 1.8GHz) ,GPU GC7000UL |
| NPU | 2.3 TOPS Neural Network performance, extend 8-26 TOPS AI card | |
| MCU | 1 x Arm Cortex –M7 core | |
|
Memory |
Technology | LPDDR4 |
| Capacity | 2GB/4GB/6GB on board | |
| Flash | 16/32GB EMMC NAND Flash for OS and 8MB SPI NOR Flash for boot loader | |
|
Graphics |
HDMI | 1 x HDMI2.0, 1920x1080 |
| Graphics Engine | GC7000UL with 2D/3D Graphic Acceleration supporting 1G Pixel/s, OpenVG 1.1, Open GL ES3.1, Vulkan, and Open CL 1.2 FP. | |
| H/W Video Codec | Decoder: H.265, H.264, VP8/9 1080p Encoder:H.264, VP8 1080p | |
| Ethernet | Ethernet | 5 x 10/100/1000Mbps (route/switch), 1 x 1G FSP fiber |
| WatchDog Timer | WatchDog Timer | 1~6553s, default 60s, power on/off 4s |
| RTC | RTC | Support |
| TPM/TCM | TPM/TCM | Support |
|
Front I/O |
Ethernet | 5 x 10/100/1000Mbps, 1 x 1G FSP fiber |
| USB | 2 x USB3.0 type A host, 2 x USB2.0 type A host | |
| HDMI | 1 x HDMI2.0, 1920x1080 | |
| Micro SD | 1 x Micro SD socket | |
| SIM | 1 x standard SIM socket | |
|
Rear I/O |
Audio | 1 x Mic , 1 x Line out, |
| MIC Array | 2 x I2S+1xI2C, support 8 channels MIC array (Digital or analog) | |
| CAN | 1 x CAN FD | |
| Serial Port | 2 x RS232/RS422/RS485, 1 x 2-wire RS232 or debug port (default:R232) | |
| GPIO | 5 | |
| Indicator | LED | 6 Green LED for power, system, storage, 5G,4G,Wi-Fi and fiber status |
|
Expansion |
Mini PCIe | 1 x mini PCIe slot (only USB2.0 signal for 4G/GPS) |
| M.2 E Key | 1 x M.2 E Key slot (for WiFi5/WiFi6, BT and 8-26 TOPS AI card) | |
| M.2 B Key | 1 x M.2 B KEY (USB3.0 for 5G) | |
| SATA | 1 x SATA2.0 Header (2.5 inch SSD) | |
| Antenna Holes | 8 (5G/4Gx4 & WIFI/BTx2&BTx1&GPSx1) | |
| Mechanical | System | 210 x 120 x 62.6 mm or 220 x 120 x 77 mm (for AI card) |
| Mounting | Wall mount | |
| Power | Power supply | 12V 3A DC-in |
| Environment | Operating temperature | 0-50°C, -40~70°C |
| Operating Humidity | 5 ~ 95% relative humidity, non-condensing | |
| Operating System | Linux, Android | |
| Certifications | CCC/CE/FCC Class B | |
Ordering Information
| Part Number | CPU | Memory | Flash | HDMI | SATA | SD | LAN | Fiber | USB | UART | Can | Audio | GPIO | TPM | MIC
Array |
Operating Temperature |
| EPC-R5710NQ-BLA1E | NXP 8M PLUS 1.8GHz | 4 GB | 16 GB | 1 | 1 | 1 | 5 | 1 | 2 USB3.0
2 USB2.0 |
2 x RS232/RS485
1 x RS232 |
1 | 1 Line out
1 MIC in |
5 | (1) | 1 | 0 ~ 50°C |
| EPC-R5710NQ-ALA1E | NXP 8M PLUS 1.8GHz | 6 GB | 16 GB | 1 | 1 | 1 | 5 | 1 | 2 USB3.0
2 USB2.0 |
2 x RS232/RS485
1 x RS232 |
1 | 1 Line out
1 MIC in |
5 | (1) | 1 | 0 ~ 50°C |
| EPC-R5710IQ-XLA1E | NXP 8M PLUS 1.8GHz | 2 GB | 16 GB | 1 | 1 | 1 | 5 | 1 | 2 USB3.0
2 USB2.0 |
2 x RS232/RS485
1 x RS232 |
1 | 1 Line out
1 MIC in |
5 | 1 | 1 | -40 ~ 70°C |
| EPC-R5710IQ-BLA1E | NXP 8M PLUS 1.8GHz | 4 GB | 16 GB | 1 | 1 | 1 | 5 | 1 | 2 USB3.0
2 USB2.0 |
2 x RS232/RS485
1 x RS232 |
1 | 1 Line out
1 MIC in |
5 | 1 | 1 | -40 ~ 70°C |
| EPC-R5710IQ-ALA1E | NXP 8M PLUS 1.8GHz | 6 GB | 16 GB | 1 | 1 | 1 | 5 | 1 | 2 USB3.0
2 USB2.0 |
2 x RS232/RS485
1 x RS232 |
1 | 1 Line out
1 MIC in |
5 | 1 | 1 | -40 ~ 70°C |
*() BOM options available on MP version.
Packing List
| Part Number | Description |
| 1960103066N001 | WALL MOUNT 2965C for EPC-R5710 |
| 1960104002N101 | Wall mount Bracket for EPC-R5710 Liquid 2965C for AI configuration |
Optional Accessories
| Part Number | Description |
| 96PSA-A36W12W7 | ADP A/D 100-240V 36W 12V WO/PFC |
| 1702002605 | Power Cord 3P EU 10A 250V 183 cm (72 in) |
| 1702031801 | Power Cord 3P UK 10A 250V 183 cm (72 in) |
| 1702002600 | Power Cord UL 3P 10A 125V 183 cm (72 in |
| 1700008921 | Power Cord 3P PSE 183 cm (72 in) |
| 1700009652 | Power Cord CCC 3P 10A 250V 187 cm (73.6 in |
| 968DD00064 | Quectel RM500Q-GL m.2 Wireless 5G Module |
| 1750009353-01 | TUBE Ant. SMA-Jack/F-BH MHF4/113 BLK 300mm for 5G |
| 1750009372-01 | Ant.SMA/M 90/180 5G BLK 167mm RG178 for 5G |
| 1990038961N000 | Thermal Pad PG45A K=4.5 45*30*2MM for 5G |
| 968AD00584 | Qucetel EC20CEFHLG Mini PCIe 4G module |
| 1750007965-01 | Antenna Cable R/P SMA (M) to MHF4, 300 mm (11.8 in) for 4G |
Optional Accessories
| Part Number | Description |
| 1750008303-01 | Antenna AN0727-64SP6BSM for 4G |
| 1970005269T000 | HD R2 32x32x27.4MM SC EPC-R5710 for 4G |
| 1990016840S000 | Thermal Pad 32x32x1.5mm GR-Hm K=6 for DAC-SC01 for 4G |
| AIW-154BN | AzureWare AW-CM276MA WiFi5 module |
| AIW-165BN | AzureWare AW-XM458MA WiFi6 module |
| 1750007965-01 | WiFi Coaxial Cable, SMA (M) to MHF4, 300 mm for WiFi5/WiFi6 |
| 1750008717-01 | WiFi Dual band 2.4G and 5G Antenna for WiFi5/WiFi6 |
| 1970005268T000 | HD R2 20x20x27.4MM SC EPC-R5710 for for WiFi5/WiFi6 |
| 1990031873N020 | Thermal pad 20x20x2.5mm(t) K=4.0 TP TG4040 for WiFi5 |
| 1990033689N000 | Thermal-Pad 20x20x1mm TP K=1.2 Eapus XR-HL for WiFi6 |
| 1990030557N000 | Thermal-Pad 70x62x2mm XR-HL K=1.2 TP Eapus for SSD |
| XCUC2SHD-MLU220 | Cambricon AI card MLU220 8Tops |
| 9696R571E00 | EPC-R5710 M.2 E Key for Cambricon AI card |
| 9696R571B00 | EPC-R5710 M.2 B KEY board for Cambricon AI card |
| TBD | Cambricon AI card MLU220 power cable |
| 2170000021 | Thermal Grease PSX-D 1Pcs=0.5g for Cambricon AI card |
| TBD | Hailo-8 HM218B1C2KAE 2230 A+E key M.2 module AI Module 26 Tops |
| 1990011911N000 | Thermal Pad 20x20x1.0mm GR-Hm K=6 for Hailo H8 AI card |
| 1700019474 | Debug cable D-SUB 9P(F)/D-SUB 9P(F) 100cm |
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