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MIO-4370

研华MIO-4370 是一款 4寸嵌入式工控主板，支持第12代Intel Core处理器（Alder Lake-S系列，LGA1700 socket CPU）处理器，高达16核，TDP 35W ，灵活socket CPU (LGA1700)并支持标准风扇散热。

第12代Intel Core处理器，高达16核，TDP 35W
灵活socket CPU (LGA1700)并支持标准风扇散热
DDR5 4800高达32GB ，3独立显示：双HDMI+eDP
双高速2.5G以太网与TSN，2x COM，CANbus，TPM
双 M.2 M-Key（支持NVMe），M.2 E-Key 扩展
支持Windows 10 LTSC和Ubuntu 20.04 LTS，嵌入式软件API 和 WISE-DeviceOn

产品型录PDF

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产品资讯

Specifications

Platform

Processor

i9-14900T

i9-13900TE

i9-12900TE

i7-14700T

i7-13700TE

i7-12700TE

i5-14500T

i5-13500TE

i5-12500TE

i3-14100T

i3-13100TE

i3-12100TE

Max. Frequency (P-core)

5.5 GHz

5.0 GHz

4.8 GHz

5.2 GHz

4.8 GHz

4.6 GHz

4.8 GHz

4.5 GHz

4.3 GHz

4.4 GHz

4.1 GHz

4.0 GHz

Base Frequency (P-core)

1.1 GHz

1.0 GHz

1.1 GHz

1.3 GHz

1.1 GHz

1.4 GHz

1.7 GHz

1.3 GHz

1.9 GHz

2.7 GHz

2.4 GHz

2.1 GHz

Cores(P+E)/Threads

24C (8+16) /

32T

24C (8+16) /

32T

16C (8+8) /

24T

20C (8+12) /

28T

16C (8+8) /

24T

12C (8+4) /

20T

14C (4+8) /

20T

14C (6+8) /

20T

6C (6+0) /

12T

4C (4+0) /

LLC

36MB

30MB

33MB

30MB

25MB

24MB

18MB

12MB

CPU TDP

35W

Chipset

R680E / H610E

BIOS

AMI UEFI 256Mbit

Memory

Technology

DDR5-4800

Max. Capacity

Up to 32GB

Channel/Socket

Single Channel / 1 x SO-DIMM Socket

Graphics

Controller

Intel® UHD Graphics 770

Intel® UHD Graphics 730

Max. Frequency

1.65 GHz

1.55 GHz

1.6 GHz

1.5 GHz

1.55 GHz

1.45 GHz

1.5 GHz

1.4 GHz

Execution Unit

3D/HW Acceleration

DX12, OGL4.5, OCL2.1, HW Encode: AVC/H264, JPEG, HEVC/H265, VP9 HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1

Display I/F

LCD

1 x eDP 1.4b, up to 5120 x 3200 @60Hz, 24bpp

HDMI/DP

2 x HDMI 1.2, up to 1920 x 1200 @60Hz, 24bpp

Multiple Display

3 simultaneous displays via eDP + HDMI + HDMI

Ethernet

Controller

LAN1/LAN2: Intel I226

Speed

LAN1/LAN2: 2.5GbE

TSN support

LAN1/LAN2: Yes

External I/O

Ethernet

2 x RJ-45

HDMI

USB

4 x USB 3.2 ; R680E: 4 x USB 3.2 Gen 2x1 (10Gbps) / H610E: 2 x USB 3.2 Gen 2x1 (10Gbps)+ 2 x USB 3.2 Gen 1x1 (5Gbps)

Internal I/O

USB

2 x USB 2.0

COM Port

2 x RS-232/422/485, max. 1Mbps

CANBus

1 x CAN2.0, max. 1Mbps

Serial Bus

1 x I2C (BOM Default, optional to 1 x SMBus*)

Audio

Realtek ALC888s, Line-in/Line-out/MIC

GPIO

8-bit general purpose input output I/O

Fan

12V, 2A (4-wire)

Front Panel Control

Power-on, Reset, Buzzer, CaseOpen

Board Feature

Watchdog Timer

65536 level, 0~65535 sec

TPM

Support ; R680E: Discrete TPM 2.0 IC / H610E: fTPM support by Intel® Platform Trust Technology

iManager 3.0

SW API for Hardware Monitor, Smart Fan Control, Brightness Control, I2C, GPIO, WDT

Expansion

M.2 M-Key

Up to 2 x M-Key 2280 (PCIe Gen. 4 x4), depends on Chipset SKU. (R680E: 2 x M-Key / H610E: 1 x M-Key)

M.2 B-Key

Up to 1 x M.2 B-Key 3042 (Only USB 2.0 interface ; with SIM slot and support bracket for LTE module), depends on Chipset SKU. (R680E: 0 / H610E: 1 x M.2 B-Key)

M.2 E-Key

1 x E-Key 2230 (PCIex1, USB2.0)

Power

Supply Voltage

Vin: DC 12V ± 10%; RTC Battery: Lithium 3V/220mAH

Connector

ATX 2x2 pin 180D (Option to ATX 2x2 pin 90D)

Power Management

AT, ATX

Max. Consumption

TBD

135.2W

TBD

113.9W

TBD

91.2W

TBD

75.4W

Idle Consumption

TBD

28.6W

TBD

23.4W

TBD

22.9W

TBD

22.3W

Environment

Temperature

Operating: Standard: 0 ~ 60° C (32 ~ 140° F)

Storage: -40 ~ 85 °C (-40 ~ 185 °F)

Humidity

Operating: 40° C @ 95% relative humidity, non-condensing Storage: 60° C @ 95%relative humidity, non-condensing

Vibration Resistance

3.5 Grms

Certification

EMC

CE, FCC Class B

Mechanical

Dimensions

115 x 165 mm (4.5 x 6.5 inches)

Net Weight

320g (w/o CPU & Cooler)

*Note: Support by request

Ordering Information

Part No.

Chipset

USB 3.2 Gen 2

(10Gbps)

USB 3.2 Gen 1

(5Gbps)

HDMI

LAN

ECC

TPM

M.2 Extension

SIM

TDP

Thermal Solution

Operating Temperature

MIO-4370R-00A1

R680E

Yes

dTPM

2 x M-Key2 + E-Key

35W3

Active Cooler

0 ~ 60 °C

MIO-4370H-00A1

H610E

fTPM1

M-Key + B-Key + E-Key

Yes

35W3

Active Cooler

0 ~ 60 °C

Note 1: BOM option to add TPM IC on board

Note 2: BOM option to change 1x M.2 M-key to 1x M.2 B-key by request.

Note 3: Hardware design only support TDP 35W processors. (Not support TDP 65W processors)

Packing List

Part No.	Description	Quantity
	MIO-4370 SBC	1
2046437000	Startup Manual	1
1700019584-01	Audio Cable, 20cm	1
1700030404-01	COM Port Cable, 20cm	2
1700030406-01	USB 2.0 Cable, 20cm	1
	Screw Kit	1
	Jumper Kit	1

Optional Accessories

Part No.	Description
1970004564T010	CPU Cooler, for TDP 35W, 75(W) x 75(L) x 25(H)mm

Embedded OS/API

OS	Part No.	Description
Windows 10 LTSC	20706WX1HS0041	Win10 IoT Ent. 2021 LTSC 64bit, High End: Core i9/i7
Windows 10 LTSC	20706WX1VS0041	Win10 IoT Ent. 2021 LTSC 64bit, Value: Core i5/i3
Ubuntu 22.04 LTS	20706U22DS0003	Ubuntu Desktop 22.04 LTS 64-bit
ROS2 Suite	Download from ESS-WIKI	Advantech ROS2 Suite v1.3.0
Software API	Website Download	SUSI v4.0
Yocto BSP	Support by Request	Yocto BSP and Test Image